Lapping

One of the fundamental data of the lapping is the use of these abrasives in a chemical environment (carrier), liquid or paste, to keep the abrasive particles free. This abrasive carrier is injected between the part and the lapping plate.

The " free abrasive " lapping process allows you to obtain two decisive criteria for the machined parts :

• The surface finish of the machined face is produced, precisely and constantly,
• An extreme flatness, the geometry of the part is directly led by the geometry of the lapping plate.

To guarantee the 2 criteria roughness and flatness :

• According to the part to be machined, you have a choice of an abrasive, abrasive carrier and lapping plate.
• The part must not be exposed to any thermal or mechanical tensions during the machining.

Une large gamme de solutions :

	Liquids Bio DIAMANT®, Pastes Bio DIAMANT®, Sticks Bio DIAMANT®, Plates NEW LAM® M’M’ bi-component Plates Série 2000 mono-component Polishing discs LAM PLAN
	Composite abrasives (silice colloïdales, Al2O3, SiC, B4C, CeO2) Abrasives pastes ( Al2O3, SiC, B4C, CeO2) Poudres abrasives ( Al2O3, SiC, B4C, CeO2) Pouders( Al2O3, SiC, B4C, CeO2) Jets ( Al2O3, SiC, B4C, CeO2) Cast Iron rings Polishing pads AQUA LAM